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Integrated Circuits and Packaging Trends. Thermally Induced Failures, Thermal Packaging, Heat Transfer From Bodies With Heat Sources, Review of Principles, Conduction in Printed Circuits, Free Convection in Pcb Arrays, Forced Convection In Pcb Arrays, Optimization of Fins and Pins, Optimization In Adhesive Layers, Boiling, Cooling With Micro Channels, Numerical Methods, Commercial Computer Codes.

Faculty: Mechanical Engineering
|Undergraduate Studies

Pre-required courses

34014 or 34041 - Heat Transfer

• Cooling techniques for electronic equipment - Steinberg, Dave S.
• Encyclopedia of Thermal Packaging (Set 1) Thermal Packaging Techniques Volumes 1-6
• Encyclopedia of thermal packaging thermal packaging tools
• Encyclopedia of thermal packaging, Set 1, Thermal packaging techniques
• Encyclopedia of thermal packaging, Set 2, Thermal packaging tools
• Encyclopedia of thermal packaging. - Bar-Cohen, Avram.
• Encyclopedia of thermal packaging. thermal packaging techniques - Geisler, Karl J. L.
• Fluid flow, heat transfer and boiling in micro-channels - Yarin, L. P.
• Fundamentals of heat and mass transfer - Incropera, Frank P.
• Fundamentals of heat and mass transfer.
• Heat transfer : thermal management of electronics - Shabany, Younes
• Silicon microchannel heat sinks : theories and phenomena - Zhang, L.
• Thermal analysis and control of electronic equipment - Kraus, Allan D.
• Thermal design heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells - Lee, Ho Sung.